Micron Technology Inc.
16 Gb DDR4 SDRAM, 2Gx8, DDR4-3200 (CL22), 1.2 V, 78-ball 7.5 x 11 mm FBGA
The Micron MT40A2G8SA-062E:F is a 16 Gb DDR4 SDRAM organized as 2 Gig x 8 with 16 banks in four bank groups, rated for DDR4-3200 (CL22) at a 1.2 V supply, in a 78-ball 7.5 x 11 mm FBGA. It is the standard discrete x8 DDR4 component for servers, networking and storage boards, industrial computing, FPGA/SoC designs and DIMM assembly, with DBI, write CRC, CA parity and post-package repair. Lead time currently runs around 53 weeks with authorized stock constrained, so allocation should be planned early. Cerametronics helps buyers find traceable spot stock.
Key Specifications
Verify against the original datasheet before quoting.
| Density / Organization | 16 Gb; 2 Gig x 8; 16 internal banks in 4 bank groups; 8n-prefetch |
|---|---|
| Speed Grade | -062E: tCK 0.625 ns (1600 MHz clock), DDR4-3200, CL22; tAA/tRCD/tRP 13.75 ns |
| Features | DBI, write CRC, CA parity, sPPR/hPPR, MBIST-PPR (rev. F), write leveling, programmable ODT, JEDEC JESD79-4 |
| Supply Voltage | VDD = VDDQ = 1.2 V ±60 mV (1.14–1.26 V); 1.2 V pseudo open-drain I/O |
| Package | SA: 78-ball FBGA, 7.5 x 11.0 mm |
| Temperature | Commercial: 0 to +95 °C case (TC); IT variant: -40 to +95 °C TC; refresh 64 ms up to 85 °C, 32 ms from 85–95 °C |
Market Status
DDR4 Supply Tightening – Spot Sourcing Available Factory lead time is currently around 53 weeks.
Quality & Traceability
Cerametronics is ISO 9001 certified and products are RoHS compliant, with counterfeit screening and full traceability on every shipment. A Certificate of Conformance is available on request. For allocation-sensitive or high-risk lots, independent third-party lab verification can be arranged — just flag it on your RFQ. Any lot that fails incoming inspection is quarantined and never shipped.
FAQ
How does MT40A2G8SA-062E:F differ from MT40A2G8VA-062E or MT40A2G8SA-062E IT:F?
The letters after the organization are the package code: SA is the 78-ball 7.5 x 11 mm FBGA, VA is 10 x 11 mm and JC is 9 x 11 mm, so VA/JC parts are not footprint-compatible with SA. IT:F is the same die and SA package qualified for -40 to +95 °C and can replace the commercial part; :F is the die revision, and MBIST-PPR is available only on revision F.
Can a -062E part be used in a DDR4-2666 or DDR4-2933 design, and are there drop-in alternatives?
Yes. DDR4-3200 (-062E) is backward-compatible and runs at slower JEDEC bins such as 2933 (-068) or 2666 (-075) with the controller programming the appropriate CL. JEDEC-standard 16 Gb x8 DDR4 parts in the 78-ball 7.5 x 11 mm footprint from Samsung or SK hynix are electrically interchangeable in most designs, but controller training, refresh and PPR settings should be re-validated.
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